T-Global Technology Thermal Paste 7.0 W/mK 1KG, TG-A7000 Silicone-Type Putty, Gel Between Liquid and Solid State, with Dispenser, Heat Sink Cooling, for Electronic Components PC Laptop/GPU/CPU

Description

Specification:Thermal Conductivity:7.0±10%W/mKViscosity: 250±100Pa·sDensity: 3.25±5%g/cm³Operating Temperature: -50~180°CVolume Resistivity: 1x10^13 Ohm-m*Syringe should be used with glue gunApplication:Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle,Electronic products, Energy Storage, Industrial, Lighting equipment, Medical, Military, Netcom, Panel, Power electronics, Robot, Servers, Smart Home, Telecom, etc.Features:Silicone-type spacer with great long term reliabilityLower thermal resistance than thermal padsPhysical property between liquid and solid stateElimination of different gap between heat source and the heatsinkCan applied with dispenser Operating Manual:1.Push the latch and insert the stick.2.Put the tube in and twist.3.Close the cover.4.Take off the plug. Storage: Store in a cool, dry place away from direct sunlight.