Description
- - Extreme Performance: Ultra low thermal resistance and superior heat conductance maintain the highest level of heat transfer between the heat source and heat sink for maximized cooling performance
- - Convenient Application and Storage: The syringe applicator provides convenience for storage and is for all applications, including computer components such as CPU, GPU and North bridge Chipset
- - High Safety Standards: The composition is dielectric (electrically non-conducting) to prevent electrical hazards and complies with RoHS (restriction of hazardous substances) for the highest level of safety
- - High Quality & Cost Effective: Excellent value for proven quality product.
- - Many Different Applications: Can be used for many uses including PC CPU/GPU, Heatsink, Chipset, LED, Home Appliances, Air con Units, Electrical Equipment & Communications Equipment incl. Fiber Optics.
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Size Name:100g Aluminium Tube
HY410 is a specially designed Thermal Paste compound for low temperatures and is used amongst other things for smooth bottom Copper Heat sinks and LED lights. Other uses include solving temperature problems in a variety of computer components including CPU/GPU, VGA, RAM and Heat-Sinks plus as a filler/secondary medium for already pasted CPU and GPUs.Thermal Conductivity: >0.925 W/m-K Thermal Impedance: <0.262°C-in2/W Specific Gravity: >2 Evaporation: 0% Bleed: 0.5% Dielectric Constant: 5.1 Viscosity: non-flowing Thixotropic Index: 380+/-10 (1/10mm) Moment Beared Temperature: -50~300°C Operation Temperature: -30~280°C
